
D20V0L1B2WS
Document number: DS35943 Rev. 3 - 2
2 of 4
www.diodes.com
April 2014
© Diodes Incorporated
D20V0L1B2WS
ADVANCE INFORMATION
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit Conditions
Peak Pulse Power Dissipation
P
PP
90 W 8/20µs, Per Figure 2
Peak Pulse Current
I
PP
3 A 8/20µs, Per Figure 2
ESD Protection – Contact Discharge
V
ESD
Contac
±30 kV Standard IEC 61000-4-2
ESD Protection – Air Discharge
V
ESD
Ai
±30 kV Standard IEC 61000-4-2
Thermal Characteristics
Characteristic Symbol Value Unit
Package Power Dissipation (Note 5)
P
D
200 mW
Thermal Resistance, Junction to Ambient (Note 5)
R
θJA
625 °C/W
Operating and Storage Temperature Range
T
J
, T
STG
-65 to +150 °C
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Standoff Voltage
V
RWM
—
— 20 V —
Channel Leakage Current (Note 6)
I
RM
— —
100 nA
V
RWM
= 20V
Clamping Voltage, Positive Transients
V
CL
—
—
27 V
I
PP
= 1A, t
= 8/20μS
— —
30 V
I
PP
= 3A, t
= 8/20μS
Breakdown Voltage
V
BR
21
—
25 V
I
R
= 1mA
Differential Resistance
R
DIF
—
1.8 —
Ω
I
R
= 1A, t
= 8/20μS
Channel Input Capacitance
C
T
—
10 15 pF
V
R
= 0V, f = 1MHz
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
0
120 160
200
250
200
150
50
40
80
100
0
T , AMBIENT TEMPERATURE ( C)
Figure 1 Power Derating Curve
A
°
,
WE
DISSI
ATI
N (mW)
D
Note 5
0
t, TIME ( s)
Figure 2 Pulse Waveform
20 40
60
100
50
0
I , PEAK PULSE CURRENT (%I )
PppP
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